Inventor

GORUN PATRICK

US5 patents

⚠️ This page may combine multiple inventors who share the name “GORUN PATRICK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GEORGE GREGORY

2 patents

US8267143B2Sep 18, 2012

Apparatus for mechanically debonding temporary bonded semiconductor wafers

GEORGE GREGORY23 citations90

US8919412B2Dec 30, 2014

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

GEORGE GREGORY3 citations60

JOHNSON HALE

1 patent

US8181688B2May 22, 2012

Apparatus for temporary wafer bonding and debonding

JOHNSON HALE25 citations87

SUSS MICROTEC LITHOGRAPHY GMBH

1 patent

US9281229B2Mar 8, 2016

Method for thermal-slide debonding of temporary bonded semiconductor wafers

SUSS MICROTEC LITHOGRAPHY GMBH3 citations71

SUSS MICROTEC AG

1 patent

US7703658B2Apr 27, 2010

Apparatus and method for semiconductor wafer bumping via injection molded solder

SUSS MICROTEC AG6 citations58