Inventor

HUGHLETT EMMETT

US4 patents

⚠️ This page may combine multiple inventors who share the name “HUGHLETT EMMETT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JOHNSON HALE

1 patent

US8181688B2May 22, 2012

Apparatus for temporary wafer bonding and debonding

JOHNSON HALE25 citations87

SUSS MICROTEC LITHOGRAPHY GMBH

1 patent

US9281229B2Mar 8, 2016

Method for thermal-slide debonding of temporary bonded semiconductor wafers

SUSS MICROTEC LITHOGRAPHY GMBH3 citations71

SUSS MICROTEC AG

1 patent

US7732320B2Jun 8, 2010

Apparatus and method for semiconductor wafer bumping via injection molded solder

SUSS MICROTEC AG6 citations69

GEORGE GREGORY

1 patent

US8919412B2Dec 30, 2014

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

GEORGE GREGORY3 citations60