Inventor
LEHTONEN SEPPO J
US5 patents
Patents
5 patentsUS6733823B2May 11, 2004
Method for electroless gold plating of conductive traces on printed circuit boards
UNIV JOHNS HOPKINS29 citations90
US6881593B2Apr 19, 2005
Semiconductor die adapter and method of using
UNIV JOHNS HOPKINS7 citations71
US12156338B2Nov 26, 2024
Chip packaged battery
UNIV JOHNS HOPKINS0 citations56
US11067449B2Jul 20, 2021
Multispectral imager
UNIV JOHNS HOPKINS0 citations34
US9844169B2Dec 12, 2017
Ka band multi-chip modulator
UNIV JOHNS HOPKINS0 citations31