Inventor
CHOU YI-HOW
TW3 patents
Patents
3 patentsUS11450558B2Sep 20, 2022
Metal interconnect structure and method for fabricating the same
UNITED MICROELECTRONICS CORP2 citations68
US12183626B2Dec 31, 2024
Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations58
US10784153B2Sep 22, 2020
Metal interconnect structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations47