Inventor

LIN YANG-CHOU

TW3 patents

Patents

3 patents

US11450558B2Sep 20, 2022

Metal interconnect structure and method for fabricating the same

UNITED MICROELECTRONICS CORP2 citations68

US12183626B2Dec 31, 2024

Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations58

US10784153B2Sep 22, 2020

Metal interconnect structure and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations47