P

Inventor

TAO TETSUYA

JP5 patents
⚠️ This page may combine multiple inventors who share the name “TAO TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC ELECTRONICS CORP

3 patents
US6756685B2Jun 29, 2004

Semiconductor device

NEC ELECTRONICS CORP56 citations93
US7170172B2Jan 30, 2007

Semiconductor device having a roughened surface

NEC ELECTRONICS CORP14 citations83
US7560372B2Jul 14, 2009

Process for making a semiconductor device having a roughened surface

NEC ELECTRONICS CORP5 citations73

NEC CORP

2 patents
US6410981B2Jun 25, 2002

Vented semiconductor device package having separate substrate, strengthening ring and cap structures

NEC CORP59 citations93
US6432807B1Aug 13, 2002

Method of forming solder bumps on a semiconductor device using bump transfer plate

NEC CORP24 citations89