Inventor

HATZL STEFAN LEOPOLD

AT10 patents

⚠️ This page may combine multiple inventors who share the name “HATZL STEFAN LEOPOLD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RF360 SINGAPORE PTE LTD

5 patents

US12261583B2Mar 25, 2025

Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods

RF360 SINGAPORE PTE LTD0 citations54

US12071339B2Aug 27, 2024

Micro-acoustic wafer-level package and method of manufacture

RF360 SINGAPORE PTE LTD0 citations51

US12316304B2May 27, 2025

Vertically coupled SAW resonators

RF360 SINGAPORE PTE LTD0 citations47

US12334909B2Jun 17, 2025

Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods

RF360 SINGAPORE PTE LTD0 citations46

US12549154B2Feb 10, 2026

Package comprising an acoustic device and a cap substrate comprising an inductor

RF360 SINGAPORE PTE LTD0 citations45

QUALCOMM INC

2 patents

US12341488B2Jun 24, 2025

Package comprising an acoustic device and a polymer cap layer

QUALCOMM INC2 citations70

US10582609B2Mar 3, 2020

Integration of through glass via (TGV) filter and acoustic filter

QUALCOMM INC4 citations70

EPCOS AG

1 patent

US9287247B2Mar 15, 2016

Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangement

EPCOS AG1 citations48

SNAPTRACK INC

1 patent

US10117329B2Oct 30, 2018

Carrier plate, device having the carrier plate and method for producing a carrier plate

SNAPTRACK INC0 citations39

BRUNNER SEBASTIAN

1 patent

US9001523B2Apr 7, 2015

Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer

BRUNNER SEBASTIAN0 citations36