P

Inventor

HO YU-HSUAN

TW26 patents
⚠️ This page may combine multiple inventors who share the name “HO YU-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINBOND ELECTRONICS CORP

24 patents
US10101291B2Oct 16, 2018

Mobile device having gas-sensing function

WINBOND ELECTRONICS CORP13 citations83
US10697919B2Jun 30, 2020

Reduction-oxidation sensor device and manufacturing method thereof

WINBOND ELECTRONICS CORP5 citations72
US10473607B2Nov 12, 2019

Gas sensor

WINBOND ELECTRONICS CORP2 citations72
US10401200B2Sep 3, 2019

Multifunctional sensor

WINBOND ELECTRONICS CORP2 citations72
US11920020B2Mar 5, 2024

Composite material and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations62
US11327038B2May 10, 2022

Sensor, composite material and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations62
US10527504B2Jan 7, 2020

Transparent pressure sensor and manufacturing method thereof

WINBOND ELECTRONICS CORP1 citations62
US10585027B2Mar 10, 2020

Particle sensing device and electronic apparatus having the same

WINBOND ELECTRONICS CORP1 citations56
US11008222B2May 18, 2021

Metal bronze compound, manufacturing method thereof, and ink

WINBOND ELECTRONICS CORP0 citations51
US10823691B2Nov 3, 2020

Sensor, composite material and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations51
US10697753B2Jun 30, 2020

Strain sensing device and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations51
US10323996B2Jun 18, 2019

Pressure sensor and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations51
US10277995B2Apr 30, 2019

Bone conduction hearing aid device and bone conduction speaker

WINBOND ELECTRONICS CORP0 citations51
US10222344B2Mar 5, 2019

Gas sensor

WINBOND ELECTRONICS CORP0 citations51
US10121696B2Nov 6, 2018

Electronic device package and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations51
US10001707B2Jun 19, 2018

Exposure method, exposure equipment and 3-D structure

WINBOND ELECTRONICS CORP0 citations51
US9955584B2Apr 24, 2018

Stamp for printed circuit process and method of fabricating the same and printed circuit process

WINBOND ELECTRONICS CORP0 citations51
US10161844B2Dec 25, 2018

Particle sensing device and electronic apparatus having the same

WINBOND ELECTRONICS CORP0 citations46
US10788521B2Sep 29, 2020

Resistive environmental sensor and resistive environmental sensor array

WINBOND ELECTRONICS CORP0 citations41
US10453620B2Oct 22, 2019

Perovskite composite structure

WINBOND ELECTRONICS CORP0 citations41
US10314174B2Jun 4, 2019

Method for manufacturing circuit board

WINBOND ELECTRONICS CORP0 citations41
US9867273B2Jan 9, 2018

Printed circuit, thin film transistor and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations41
US10842421B2Nov 24, 2020

Sensing device, nursing bra, and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations40
US10282964B2May 7, 2019

Gas detecting device

WINBOND ELECTRONICS CORP0 citations40

DELTA ELECTRONICS INC

1 patent

AU OPTRONICS CORP

1 patent