Inventor
HO YU-HSUAN
TW26 patents
⚠️ This page may combine multiple inventors who share the name “HO YU-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
24 patentsUS10101291B2Oct 16, 2018
Mobile device having gas-sensing function
WINBOND ELECTRONICS CORP13 citations83
US10697919B2Jun 30, 2020
Reduction-oxidation sensor device and manufacturing method thereof
WINBOND ELECTRONICS CORP5 citations72
US10473607B2Nov 12, 2019
Gas sensor
WINBOND ELECTRONICS CORP2 citations72
US10401200B2Sep 3, 2019
Multifunctional sensor
WINBOND ELECTRONICS CORP2 citations72
US11920020B2Mar 5, 2024
Composite material and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations62
US11327038B2May 10, 2022
Sensor, composite material and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations62
US10527504B2Jan 7, 2020
Transparent pressure sensor and manufacturing method thereof
WINBOND ELECTRONICS CORP1 citations62
US10585027B2Mar 10, 2020
Particle sensing device and electronic apparatus having the same
WINBOND ELECTRONICS CORP1 citations56
US11008222B2May 18, 2021
Metal bronze compound, manufacturing method thereof, and ink
WINBOND ELECTRONICS CORP0 citations51
US10823691B2Nov 3, 2020
Sensor, composite material and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations51
US10697753B2Jun 30, 2020
Strain sensing device and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations51
US10323996B2Jun 18, 2019
Pressure sensor and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations51
US10277995B2Apr 30, 2019
Bone conduction hearing aid device and bone conduction speaker
WINBOND ELECTRONICS CORP0 citations51
US10222344B2Mar 5, 2019
Gas sensor
WINBOND ELECTRONICS CORP0 citations51
US10121696B2Nov 6, 2018
Electronic device package and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations51
US10001707B2Jun 19, 2018
Exposure method, exposure equipment and 3-D structure
WINBOND ELECTRONICS CORP0 citations51
US9955584B2Apr 24, 2018
Stamp for printed circuit process and method of fabricating the same and printed circuit process
WINBOND ELECTRONICS CORP0 citations51
US10161844B2Dec 25, 2018
Particle sensing device and electronic apparatus having the same
WINBOND ELECTRONICS CORP0 citations46
US10788521B2Sep 29, 2020
Resistive environmental sensor and resistive environmental sensor array
WINBOND ELECTRONICS CORP0 citations41
US10453620B2Oct 22, 2019
Perovskite composite structure
WINBOND ELECTRONICS CORP0 citations41
US10314174B2Jun 4, 2019
Method for manufacturing circuit board
WINBOND ELECTRONICS CORP0 citations41
US9867273B2Jan 9, 2018
Printed circuit, thin film transistor and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations41
US10842421B2Nov 24, 2020
Sensing device, nursing bra, and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations40
US10282964B2May 7, 2019
Gas detecting device
WINBOND ELECTRONICS CORP0 citations40