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Inventor
DIEZ WALTER
DE
2 patents
Patents
2 patents
US8901739B2
Dec 2, 2014
Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
INFINEON TECHNOLOGIES AG
10 citations
81
US7221180B2
May 22, 2007
Device and method for testing electronic components
INFINEON TECHNOLOGIES AG
2 citations
51