P

Inventor

NAJJAR ELIE H

US9 patents
⚠️ This page may combine multiple inventors who share the name “NAJJAR ELIE H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MACDERMID ENTHONE INC

4 patents
US12157944B2Dec 3, 2024

Method and wet chemical compositions for diffusion barrier formation

MACDERMID ENTHONE INC0 citations56
US11873568B2Jan 16, 2024

Compositions and methods for the electrodeposition of nanotwinned copper

MACDERMID ENTHONE INC0 citations56
US11846018B2Dec 19, 2023

Method and wet chemical compositions for diffusion barrier formation

MACDERMID ENTHONE INC0 citations56
US11384446B2Jul 12, 2022

Compositions and methods for the electrodeposition of nanotwinned copper

MACDERMID ENTHONE INC1 citations56

ROHM & HAAS ELECT MAT

2 patents
US9598787B2Mar 21, 2017

Method of filling through-holes

ROHM & HAAS ELECT MAT3 citations69
US10154598B2Dec 11, 2018

Filling through-holes

ROHM & HAAS ELECT MAT0 citations38

NIAZIMBETOVA ZUKHRA I

1 patent
US8268158B2Sep 18, 2012

Plating bath and method

NIAZIMBETOVA ZUKHRA I20 citations90

SHIPLEY CO LLC

1 patent
US6827839B2Dec 7, 2004

Plating bath analysis

SHIPLEY CO LLC33 citations90

NAJJAR ELIE H

1 patent
US9365943B2Jun 14, 2016

Method of electroplating uniform copper layers

NAJJAR ELIE H0 citations33