Inventor
WENSEL RICHARD W
US35 patents
⚠️ This page may combine multiple inventors who share the name “WENSEL RICHARD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
34 patentsUS5989941ANov 23, 1999
Encapsulated integrated circuit packaging
MICRON TECHNOLOGY INC150 citations99
US6316290B1Nov 13, 2001
Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrate
MICRON TECHNOLOGY INC51 citations96
US6117708ASep 12, 2000
Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC59 citations96
US6001672ADec 14, 1999
Method for transfer molding encapsulation of a semiconductor die with attached heat sink
MICRON TECHNOLOGY INC43 citations96
US6555898B2Apr 29, 2003
Dam structure for center-bonded chip package
MICRON TECHNOLOGY INC21 citations92
US6555412B1Apr 29, 2003
Packaged semiconductor chip and method of making same
MICRON TECHNOLOGY INC19 citations92
US6417028B2Jul 9, 2002
Method and apparatus for removing contaminants on electronic devices
MICRON TECHNOLOGY INC20 citations92
US6230719B1May 15, 2001
Apparatus for removing contaminants on electronic devices
MICRON TECHNOLOGY INC34 citations92
US5885854AMar 23, 1999
Method for application of de-wetting material for glob top applications
MICRON TECHNOLOGY INC27 citations92
US6921860B2Jul 26, 2005
Microelectronic component assemblies having exposed contacts
MICRON TECHNOLOGY INC39 citations91
US6403387B1Jun 11, 2002
Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink
MICRON TECHNOLOGY INC9 citations82
US6096163AAug 1, 2000
Method and apparatus for application of spray adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC13 citations82
US5969427AOct 19, 1999
Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC10 citations82
US5963792AOct 5, 1999
Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC14 citations82
US5959349ASep 28, 1999
Transfer molding encapsulation of a semiconductor die with attached heat sink
MICRON TECHNOLOGY INC12 citations82
US6677681B2Jan 13, 2004
Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break
MICRON TECHNOLOGY INC4 citations74
US6664646B2Dec 16, 2003
Chip-on-board assemblies, carrier assemblies and carrier substrates using residual organic compounds to facilitate gate break
MICRON TECHNOLOGY INC6 citations74
US6583504B2Jun 24, 2003
Semiconductor die with attached heat sink and transfer mold
MICRON TECHNOLOGY INC6 citations74
US6576057B2Jun 10, 2003
Method and apparatus for application of spray adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC6 citations74
US6545368B2Apr 8, 2003
Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC5 citations74
US6524960B2Feb 25, 2003
Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC8 citations74
US6518186B1Feb 11, 2003
Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC8 citations74
US6404069B2Jun 11, 2002
Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC6 citations74
US6373132B2Apr 16, 2002
Semiconductor die with attached heat sink and transfer mold
MICRON TECHNOLOGY INC4 citations74
US6251702B1Jun 26, 2001
Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC6 citations74
US6249050B1Jun 19, 2001
Encapsulated transfer molding of a semiconductor die with attached heat sink
MICRON TECHNOLOGY INC8 citations74
US6192956B1Feb 27, 2001
Method and apparatus for application of spray adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC6 citations74
US5936310AAug 10, 1999
De-wetting material for glob top applications
MICRON TECHNOLOGY INC11 citations74
US6869811B2Mar 22, 2005
Methods for transfer molding encapsulation of a semiconductor die with attached heat sink
MICRON TECHNOLOGY INC2 citations63
US6734372B2May 11, 2004
Gate area relief strip for a molded I/C package
MICRON TECHNOLOGY INC2 citations63
US6707165B2Mar 16, 2004
Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
MICRON TECHNOLOGY INC2 citations63
US6486004B1Nov 26, 2002
Method and apparatus for application of spray adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC2 citations63
US6030857AFeb 29, 2000
Method for application of spray adhesive to a leadframe for chip bonding
MICRON TECHNOLOGY INC2 citations63
US7061082B2Jun 13, 2006
Semiconductor die with attached heat sink and transfer mold
MICRON TECHNOLOGY INC0 citations52