Inventor
OOKYUU SATOSHI
JP4 patents
Patents
4 patentsUS6245599B1Jun 12, 2001
Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate
MITSUBISHI ELECTRIC CORP30 citations90
US5902119AMay 11, 1999
Leadframe tip arrangement designing method
MITSUBISHI ELECTRIC CORP2 citations62
US6134700AOct 17, 2000
Leadframe tip arrangement designing method
MITSUBISHI ELECTRIC CORP1 citations51
US6159766ADec 12, 2000
Designing method of leadframe tip arrangement
MITSUBISHI ELECTRIC CORP0 citations50