Inventor
NOYAN ISMAIL C
US15 patents
Patents
15 patentsUS5093879AMar 3, 1992
Electro-optical connectors
IBM218 citations97
US5263620ANov 23, 1993
Wirebond removal apparatus using alternating fluid stream
IBM30 citations92
US5186632AFeb 16, 1993
Electronic device elastomeric mounting and interconnection technology
IBM36 citations92
US5117275AMay 26, 1992
Electronic substrate multiple location conductor attachment technology
IBM28 citations92
US5093890AMar 3, 1992
Optical bus for computer systems
IBM39 citations92
US5006925AApr 9, 1991
Three dimensional microelectric packaging
IBM25 citations92
US7214548B2May 8, 2007
Apparatus and method for flattening a warped substrate
IBM18 citations79
US5233221AAug 3, 1993
Electronic substrate multiple location conductor attachment technology
IBM11 citations73
US5229328AJul 20, 1993
Method for bonding dielectric mounted conductors to semiconductor chip contact pads
IBM17 citations73
US5074969ADec 24, 1991
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
IBM8 citations73
US5047834ASep 10, 1991
High strength low stress encapsulation of interconnected semiconductor devices
IBM7 citations73
US5446261AAug 29, 1995
Solder application system using helix to control solder meniscus
IBM9 citations72
US5205461AApr 27, 1993
Method and apparatus for fluxless solder bonding
IBM16 citations72
US5038195AAug 6, 1991
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
IBM4 citations62
US5322204AJun 21, 1994
Electronic substrate multiple location conductor attachment technology
IBM0 citations52