Inventor
SUPPELSA ANTHONY J
US24 patents
⚠️ This page may combine multiple inventors who share the name “SUPPELSA ANTHONY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
18 patentsUS5421083AJun 6, 1995
Method of manufacturing a circuit carrying substrate having coaxial via holes
MOTOROLA INC178 citations98
US5379186AJan 3, 1995
Encapsulated electronic component having a heat diffusing layer
MOTOROLA INC116 citations97
US5709905AJan 20, 1998
Apparatus and method for automatic monitoring and control of stencil printing
MOTOROLA INC67 citations95
US5689403ANov 18, 1997
Intercooled electronic device
MOTOROLA INC70 citations93
US5808711ASep 15, 1998
Transparent or reflective liquid crystal display assembly with electrochromic and cholesteric layer
MOTOROLA INC47 citations92
US5771004AJun 23, 1998
Gas detection system for a portable communication
MOTOROLA INC40 citations92
US5823316AOct 20, 1998
Method for automatic conveyor width adjustment
MOTOROLA INC36 citations91
US5707052AJan 13, 1998
System for supporting a printed circuit board during assembly
MOTOROLA INC26 citations90
US5300808AApr 5, 1994
EPROM package and method of optically erasing
MOTOROLA INC32 citations89
US5740066AApr 14, 1998
Electrical circuit board and circuit board assembly
MOTOROLA INC14 citations73
US5654676AAug 5, 1997
Shielded VCO module having trimmable capacitor plate external to shield
MOTOROLA INC11 citations73
US5650755AJul 22, 1997
Voltage controlled oscillator module assembly
MOTOROLA INC9 citations73
US5373276ADec 13, 1994
Self centering coil
MOTOROLA INC8 citations73
US5411199AMay 2, 1995
Method for attaching a shield
MOTOROLA INC15 citations72
US5860583AJan 19, 1999
Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow
MOTOROLA INC7 citations71
US5075820ADec 24, 1991
Circuit components having different characteristics with constant size
MOTOROLA INC5 citations63
US5647529AJul 15, 1997
Method of controlling the temperature of a portion of an electronic part during solder reflow
MOTOROLA INC6 citations60
US6229097B1May 8, 2001
Substrate having trim window in a C5 array
MOTOROLA INC5 citations57
MOTOROLA SOLUTIONS INC
6 patentsUS10577099B2Mar 3, 2020
Inductive landing apparatus for an unmanned aerial vehicle
MOTOROLA SOLUTIONS INC15 citations84
US10049419B1Aug 14, 2018
Mobile law enforcement communication system and method
MOTOROLA SOLUTIONS INC12 citations82
US9450346B1Sep 20, 2016
Electrical contact pin having a ledge and/or a groove coupled to a printed circuit board
MOTOROLA SOLUTIONS INC3 citations72
US12328826B2Jun 10, 2025
Solder pads with concave edges for ball grid arrays
MOTOROLA SOLUTIONS INC0 citations58
US9502799B2Nov 22, 2016
Connector device
MOTOROLA SOLUTIONS INC0 citations51
US9479213B2Oct 25, 2016
Control interface for a communication device
MOTOROLA SOLUTIONS INC1 citations51