Inventor

WINER PAUL

US51 patents

⚠️ This page may combine multiple inventors who share the name “WINER PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINER PAUL

INTEL CORP

Flip-chip having an on-chip decoupling capacitor

Substrate interconnect for power distribution on integrated circuits

Substrate interconnect for power distribution on integrated circuits

Liquid crystal display devices having fill holes and electrical contacts on the back side of the die

Technique for determining semiconductor substrate thickness

Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate

Method and apparatus for endpointing while milling an integrated circuit

Fiducial for aligning an integrated circuit die

Method and apparatus for synchronizing a mode locked laser with a device under test

Semiconductor substrate having alignment marks for locating circuitry on the substrate

Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing

Method and apparatus providing a mechanical probe structure in an integrated circuit die

Method of making a circuit edit interconnect structure through the backside of an integrated circuit die

Apparatus for cooling a semiconductor die

LED pattern projector for 3D camera platforms

LED pattern projector for 3D camera platforms

Failsafe pulsed laser driver

Liquid crystal display devices having fill holes and electrical contacts on the back side of the die

High performance via capacitor and method for manufacturing same

Method and apparatus for displaying information with an integrated circuit device

Method and apparatus for editing an integrated circuit

Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate

Method of forming a fiducial for aligning an integrated circuit die

Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing

Method and apparatus for fabricating encapsulated micro-channels in a substrate

Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing

Object position determination

Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates

Circuit edit interconnect structure through the backside of an integrated circuit die

Method and system of adaptable exposure control and light projection for cameras

Techniques, apparatus, system and method for improved display calibration

Methods and apparatus to calibrate spatial light modulators

Projector for active stereo depth sensors

Synchronization of lamp stabilizing pulses with frame rates of PWM LCOS devices

Deep computational holography

Deep computational holography

Illumination modulation technique

Failsafe pulsed laser driver

Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing

Apparatus for fabricating encapsulated micro-channels in a substrate

Method and apparatus for making and using an improved fiducial for an integrated circuit

Method and apparatus for making and using an improved fiducial for an intergrated circuit

Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates

WINER PAUL

Providing timing information over a data link

Efficient luminous display

Digitally modulated image projection system

Backlight modulation to provide synchronization between shutter glasses and three dimensional (3D) display

SONY GROUP CORP

Projector for active stereo depth sensors

Method and system of adaptable exposure control and light projection for cameras

VASQUEZ MAXIMINO

Backlight modulation over external display interfaces to save power