P

Inventor

STIMSON BRADLEY O

US34 patents
⚠️ This page may combine multiple inventors who share the name “STIMSON BRADLEY O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

26 patents
US6344419B1Feb 5, 2002

Pulsed-mode RF bias for sidewall coverage improvement

APPLIED MATERIALS INC180 citations99
US6264812B1Jul 24, 2001

Method and apparatus for generating a plasma

APPLIED MATERIALS INC98 citations98
US6190513B1Feb 20, 2001

Darkspace shield for improved RF transmission in inductively coupled plasma sources for sputter deposition

APPLIED MATERIALS INC90 citations98
US6221221B1Apr 24, 2001

Apparatus for providing RF return current path control in a semiconductor wafer processing system

APPLIED MATERIALS INC154 citations97
US6673724B2Jan 6, 2004

Pulsed-mode RF bias for side-wall coverage improvement

APPLIED MATERIALS INC49 citations96
US6345588B1Feb 12, 2002

Use of variable RF generator to control coil voltage distribution

APPLIED MATERIALS INC43 citations96
US6297595B1Oct 2, 2001

Method and apparatus for generating a plasma

APPLIED MATERIALS INC76 citations96
US6228229B1May 8, 2001

Method and apparatus for generating a plasma

APPLIED MATERIALS INC74 citations96
US5629653AMay 13, 1997

RF match detector circuit with dual directional coupler

APPLIED MATERIALS INC91 citations96
US6254738B1Jul 3, 2001

Use of variable impedance having rotating core to control coil sputter distribution

APPLIED MATERIALS INC61 citations95
US5712592AJan 27, 1998

RF plasma power supply combining technique for increased stability

APPLIED MATERIALS INC85 citations94
US6824658B2Nov 30, 2004

Partial turn coil for generating a plasma

APPLIED MATERIALS INC25 citations93
US6461483B1Oct 8, 2002

Method and apparatus for performing high pressure physical vapor deposition

APPLIED MATERIALS INC35 citations93
US6219219B1Apr 17, 2001

Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system

APPLIED MATERIALS INC63 citations93
US5685941ANov 11, 1997

Inductively coupled plasma reactor with top electrode for enhancing plasma ignition

APPLIED MATERIALS INC62 citations93
US6719883B2Apr 13, 2004

Use of variable RF generator to control coil voltage distribution

APPLIED MATERIALS INC34 citations92
US6554979B2Apr 29, 2003

Method and apparatus for bias deposition in a modulating electric field

APPLIED MATERIALS INC50 citations92
US6254746B1Jul 3, 2001

Recessed coil for generating a plasma

APPLIED MATERIALS INC47 citations92
US5972178AOct 26, 1999

Continuous process for forming improved titanium nitride barrier layers

APPLIED MATERIALS INC52 citations92
US6723214B2Apr 20, 2004

Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system

APPLIED MATERIALS INC22 citations90
US6077353AJun 20, 2000

Pedestal insulator for a pre-clean chamber

APPLIED MATERIALS INC35 citations90
US6625003B2Sep 23, 2003

Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck

APPLIED MATERIALS INC22 citations89
US7815782B2Oct 19, 2010

PVD target

APPLIED MATERIALS INC17 citations84
US6235169B1May 22, 2001

Modulated power for ionized metal plasma deposition

APPLIED MATERIALS INC17 citations84
US7163607B2Jan 16, 2007

Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system

APPLIED MATERIALS INC10 citations82
US5879176AMar 9, 1999

Interlocked connector

APPLIED MATERIALS INC13 citations74

QUANTUMSCAPE CORP

5 patents

STIMSON BRADLEY O

1 patent

INAGAWA MAKOTO

1 patent

HOSOKAWA AKIHIRO

1 patent