Inventor
DIBBLE ERIC P
US8 patents
Patents
8 patentsUS5316788AMay 31, 1994
Applying solder to high density substrates
IBM182 citations95
US6040631AMar 21, 2000
Method of improved cavity BGA circuit package
IBM24 citations91
US4976626ADec 11, 1990
Connector for connecting flexible film circuit carrier to board or card
IBM39 citations91
US5952716ASep 14, 1999
Pin attach structure for an electronic package
IBM33 citations90
US6438830B1Aug 27, 2002
Process of producing plastic pin grid array
IBM14 citations82
US4774151ASep 27, 1988
Low contact electrical resistant composition, substrates coated therewith, and process for preparing such
IBM23 citations80
US4849079AJul 18, 1989
Process for preparing low electrical contact resistance composition
IBM14 citations71
US4409071AOct 11, 1983
Masking for selective electroplating jet method
IBM5 citations61