Inventor

NIEDRICH DANIEL S

US3 patents

⚠️ This page may combine multiple inventors who share the name “NIEDRICH DANIEL S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

2 patents

US5316788AMay 31, 1994

Applying solder to high density substrates

IBM182 citations95

US5011658AApr 30, 1991

Copper doped low melt solder for component assembly and rework

IBM26 citations88

NETAPP INC

1 patent

US7672590B2Mar 2, 2010

Data center with mobile data cabinets and method of mobilizing and connecting data processing devices in a data center using consolidated data communications and power connections

NETAPP INC10 citations77