P

Inventor

AMAKO JUN

JP49 patents
⚠️ This page may combine multiple inventors who share the name “AMAKO JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEIKO EPSON CORP

37 patents
US6031201AFeb 29, 2000

Laser machining apparatus with rotatable phase grating

SEIKO EPSON CORP189 citations99
US5682214AOct 28, 1997

Optical apparatus for controlling the wavefront of a coherent light

SEIKO EPSON CORP126 citations99
US6812549B2Nov 2, 2004

Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument

SEIKO EPSON CORP157 citations98
US6635850B2Oct 21, 2003

Laser machining method for precision machining

SEIKO EPSON CORP76 citations98
US5589955ADec 31, 1996

Optical device and optical machining system using the optical device

SEIKO EPSON CORP112 citations98
US6563079B1May 13, 2003

Method for machining work by laser beam

SEIKO EPSON CORP72 citations96
US6376799B1Apr 23, 2002

Laser machining apparatus with a rotatable phase grating

SEIKO EPSON CORP38 citations96
US5497254AMar 5, 1996

Optical apparatus including a liquid crystal modulator

SEIKO EPSON CORP78 citations96
US7157661B2Jan 2, 2007

Method and apparatus for laser machining

SEIKO EPSON CORP46 citations93
US7755718B2Jul 13, 2010

Optical element, liquid crystal device, and display

SEIKO EPSON CORP35 citations92
US7722194B2May 25, 2010

Optical element having a reflected light diffusing function and a polarization separation function and a projection display device

SEIKO EPSON CORP35 citations92
US7104703B2Sep 12, 2006

Optical transceiver and method for producing the same

SEIKO EPSON CORP39 citations92
US7009138B2Mar 7, 2006

Laser processing method, laser welding method, and laser processing apparatus

SEIKO EPSON CORP61 citations92
US6596634B2Jul 22, 2003

Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument

SEIKO EPSON CORP37 citations92
US6424048B1Jul 23, 2002

Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them

SEIKO EPSON CORP18 citations92
US8836947B2Sep 16, 2014

Sample analysis element and detecting device

SEIKO EPSON CORP7 citations84
US7972017B2Jul 5, 2011

Optical element having a diffractive layer and a relief pattern with concave and convex portions

SEIKO EPSON CORP13 citations84
US7944544B2May 17, 2011

Liquid crystal device having a diffraction function layer that includes a flat portion and a non-flat portion with a grid disposed in the non-flat portion

SEIKO EPSON CORP15 citations84
US7867692B2Jan 11, 2011

Method for manufacturing a microstructure, exposure device, and electronic apparatus

SEIKO EPSON CORP7 citations84
US7255806B2Aug 14, 2007

Substrate processing method, method of manufacturing micro lens sheet, transmission screen, projector, display device, and substrate processing apparatus

SEIKO EPSON CORP19 citations84
US7169537B2Jan 30, 2007

Method of manufacturing ink jet head and ink jet head

SEIKO EPSON CORP10 citations84
US6946620B2Sep 20, 2005

Laser processing method and laser processing apparatus

SEIKO EPSON CORP12 citations84
US7241967B2Jul 10, 2007

Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device

SEIKO EPSON CORP7 citations74
US6781089B2Aug 24, 2004

Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device

SEIKO EPSON CORP9 citations74
US6775958B2Aug 17, 2004

Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product

SEIKO EPSON CORP9 citations74
US6677237B2Jan 13, 2004

Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them

SEIKO EPSON CORP12 citations74
US6642480B2Nov 4, 2003

Laser processing method and laser processing apparatus

SEIKO EPSON CORP9 citations74
US9057697B2Jun 16, 2015

Optical device with propagating and localized surface plasmons and detection apparatus

SEIKO EPSON CORP6 citations73
US8817263B2Aug 26, 2014

Sample analysis element and detecting device

SEIKO EPSON CORP5 citations73
US6507003B2Jan 14, 2003

Method and apparatus for laser processing

SEIKO EPSON CORP10 citations73
US9151666B2Oct 6, 2015

Sensor chip, sensor cartridge, and analysis apparatus

SEIKO EPSON CORP2 citations63
US7762650B2Jul 27, 2010

Method of manufacturing ink jet head and ink jet head

SEIKO EPSON CORP2 citations63
US7387682B2Jun 17, 2008

Liquid drop discharge device, printer, printing method, and electro-optical device

SEIKO EPSON CORP5 citations63
US7339734B2Mar 4, 2008

Polarization control element, manufacturing method of polarization control element, design method of polarization control element, and electronic equipment

SEIKO EPSON CORP4 citations63
US9228944B2Jan 5, 2016

Sample analysis element and detection device

SEIKO EPSON CORP0 citations52
US9222889B2Dec 29, 2015

Sample analysis device, testing apparatus, and sensor cartridge

SEIKO EPSON CORP1 citations52
US7885004B2Feb 8, 2011

Optical element, liquid crystal device, and display

SEIKO EPSON CORP1 citations52

AMAKO JUN

9 patents

SAKAGAMI YUSUKE

3 patents