Inventor
BRIST GARY A
US30 patents
⚠️ This page may combine multiple inventors who share the name “BRIST GARY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
26 patentsUS7022919B2Apr 4, 2006
Printed circuit board trace routing method
INTEL CORP81 citations97
US6916183B2Jul 12, 2005
Array socket with a dedicated power/ground conductor bus
INTEL CORP70 citations97
US6747216B2Jun 8, 2004
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
INTEL CORP52 citations94
US7043706B2May 9, 2006
Conductor trace design to reduce common mode cross-talk and timing skew
INTEL CORP24 citations92
US6882762B2Apr 19, 2005
Waveguide in a printed circuit board and method of forming the same
INTEL CORP33 citations92
US6642158B1Nov 4, 2003
Photo-thermal induced diffusion
INTEL CORP13 citations92
US7269899B2Sep 18, 2007
Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
INTEL CORP11 citations91
US7480435B2Jan 20, 2009
Embedded waveguide printed circuit board structure
INTEL CORP22 citations88
US7691458B2Apr 6, 2010
Carrier substrate with a thermochromatic coating
INTEL CORP11 citations84
US7630601B2Dec 8, 2009
Connecting a component with an embedded optical fiber
INTEL CORP12 citations83
US7361842B2Apr 22, 2008
Apparatus and method for an embedded air dielectric for a package and a printed circuit board
INTEL CORP11 citations82
US7121841B2Oct 17, 2006
Electrical socket with compressible domed contacts
INTEL CORP12 citations82
US7843057B2Nov 30, 2010
Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method
INTEL CORP5 citations73
US7249955B2Jul 31, 2007
Connection of package, board, and flex cable
INTEL CORP8 citations73
US7145243B2Dec 5, 2006
Photo-thermal induced diffusion
INTEL CORP9 citations73
US7064063B2Jun 20, 2006
Photo-thermal induced diffusion
INTEL CORP9 citations73
US7373068B2May 13, 2008
Connecting a component with an embedded optical fiber
INTEL CORP5 citations72
US7723618B2May 25, 2010
Shifted segment layout for differential signal traces to mitigate bundle weave effect
INTEL CORP2 citations62
US7427719B2Sep 23, 2008
Shifted segment layout for differential signal traces to mitigate bundle weave effect
INTEL CORP4 citations62
US7343576B2Mar 11, 2008
Conductor trace design to reduce common mode cross-talk and timing skew
INTEL CORP3 citations62
US7797826B2Sep 21, 2010
Method of power-ground plane partitioning to utilize channel/trenches
INTEL CORP1 citations61
US7234947B2Jun 26, 2007
Electrical socket with compressible domed contacts
INTEL CORP2 citations61
US7977581B2Jul 12, 2011
Shifted segment layout for differential signal traces to mitigate bundle weave effect
INTEL CORP0 citations51
US10309781B2Jun 4, 2019
Computing a magnetic heading
INTEL CORP0 citations50
US9816814B2Nov 14, 2017
Magnetometer unit for electronic devices
INTEL CORP1 citations50
US9939497B2Apr 10, 2018
Dynamically calibrating magnetic sensors
INTEL CORP0 citations39