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Inventor
YIP LAURENE
US
2 patents
⚠️ This page may combine multiple inventors who share the name “YIP LAURENE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
1 patent
US7906857B1
Mar 15, 2011
Molded integrated circuit package and method of forming a molded integrated circuit package
XILINX INC
30 citations
89
YIP LAURENE
1 patent
US8410604B2
Apr 2, 2013
Lead-free structures in a semiconductor device
YIP LAURENE
2 citations
53