Inventor

CHANG-CHIEN JACK

TW2 patents

⚠️ This page may combine multiple inventors who share the name “CHANG-CHIEN JACK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK CORP

1 patent

US7435624B2Oct 14, 2008

Method of reducing mechanical stress on a semiconductor die during fabrication

SANDISK CORP4 citations58

CHIU CHIN-TIEN

1 patent

US8878346B2Nov 4, 2014

Molded SiP package with reinforced solder columns

CHIU CHIN-TIEN0 citations45