Inventor
SUN TIANWEI
US7 patents
⚠️ This page may combine multiple inventors who share the name “SUN TIANWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
4 patentsUS11128268B1Sep 21, 2021
Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof
NXP USA INC10 citations82
US11616040B2Mar 28, 2023
Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
NXP USA INC2 citations71
US10923451B2Feb 16, 2021
Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
NXP USA INC0 citations60
US9893156B2Feb 13, 2018
Segmented field plate structure
NXP USA INC0 citations50
BEIJING XIAOMI PINECONE ELECTRONICS CO LTD
2 patentsUS11417335B2Aug 16, 2022
Method and device for information processing, terminal, server and storage medium
BEIJING XIAOMI PINECONE ELECTRONICS CO LTD0 citations52
US11798545B2Oct 24, 2023
Speech interaction method and apparatus, device and storage medium
BEIJING XIAOMI PINECONE ELECTRONICS CO LTD0 citations41