Inventor

HASEGAWA HIDENORI

JP12 patents

⚠️ This page may combine multiple inventors who share the name “HASEGAWA HIDENORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKI ELECTRIC IND CO LTD

4 patents

US6852570B2Feb 8, 2005

Method of manufacturing a stacked semiconductor device

OKI ELECTRIC IND CO LTD17 citations91

US6630368B2Oct 7, 2003

Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device

OKI ELECTRIC IND CO LTD8 citations72

US7247949B2Jul 24, 2007

Semiconductor device with stacked chips

OKI ELECTRIC IND CO LTD0 citations50

US6822322B1Nov 23, 2004

Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device

OKI ELECTRIC IND CO LTD1 citations50

OKI SEMICONDUCTOR CO LTD

2 patents

US7911047B2Mar 22, 2011

Semiconductor device and method of fabricating the semiconductor device

OKI SEMICONDUCTOR CO LTD14 citations83

US8053275B2Nov 8, 2011

Semiconductor device having double side electrode structure and method of producing the same

OKI SEMICONDUCTOR CO LTD15 citations82

HASEGAWA HIDENORI

2 patents

US8643161B2Feb 4, 2014

Semiconductor device having double side electrode structure

HASEGAWA HIDENORI2 citations58

US8482113B2Jul 9, 2013

Semiconductor device

HASEGAWA HIDENORI2 citations58

YASKAWA DENKI SEISAKUSHO KK

1 patent

US6750445B1Jun 15, 2004

Encoder

YASKAWA DENKI SEISAKUSHO KK9 citations73

MEINAN MACHINERY WORKS

1 patent

US4725325AFeb 16, 1988

Method of producing laminated plate

MEINAN MACHINERY WORKS3 citations61

OKI ELECTIC INDUSTRY CO LTD

1 patent

US7172924B2Feb 6, 2007

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

OKI ELECTIC INDUSTRY CO LTD2 citations55

ASAHI KASEI MICRODEVICES CORP

1 patent

US10247759B2Apr 2, 2019

Current sensor

ASAHI KASEI MICRODEVICES CORP0 citations39