Inventor

TAY MEI QI

MY2 patents

Patents

2 patents

US12027436B2Jul 2, 2024

Package with clip having through hole accommodating component-related structure

INFINEON TECHNOLOGIES AG0 citations55

US11355429B2Jun 7, 2022

Electrical interconnect structure with radial spokes for improved solder void control

INFINEON TECHNOLOGIES AG0 citations50