Inventor
LIN SHENG-YUAN
TW34 patents
⚠️ This page may combine multiple inventors who share the name “LIN SHENG-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
18 patentsUS11415878B2Aug 16, 2022
Pellicle frame with stress relief trenches
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12562347B2Feb 24, 2026
Connect structure for semiconductor processing equipment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12518980B2Jan 6, 2026
Semiconductor substrate bonding tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12130551B2Oct 29, 2024
Pellicle frame with stress relief trenches
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12040163B2Jul 16, 2024
Connect structure for semiconductor processing equipment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11862482B2Jan 2, 2024
Semiconductor substrate bonding tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11726401B2Aug 15, 2023
Pellicle frame with stress relief trenches
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12020994B2Jun 25, 2024
Power alarm and fire loading risk reduction for a deposition tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12002699B2Jun 4, 2024
Wafer pod transfer assembly
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11600506B2Mar 7, 2023
Wafer pod transfer assembly
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11955317B2Apr 9, 2024
Radio frequency match strap assembly
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US12466727B2Nov 11, 2025
Extended acid etch for oxide removal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11655146B2May 23, 2023
Extended acid etch for oxide removal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12243848B2Mar 4, 2025
Methods and systems for improving fusion bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US12394647B2Aug 19, 2025
Wafer shift detection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10083860B2Sep 25, 2018
Semiconductor structure with resist protective oxide on isolation structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
US9633860B2Apr 25, 2017
Semiconductor structure with resist protective oxide on isolation structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
US12286706B2Apr 29, 2025
Structures and methods for processing a semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46
TAIWAN SEMICONDUCTOR MFG
7 patentsUS7825024B2Nov 2, 2010
Method of forming through-silicon vias
TAIWAN SEMICONDUCTOR MFG170 citations98
US8053902B2Nov 8, 2011
Isolation structure for protecting dielectric layers from degradation
TAIWAN SEMICONDUCTOR MFG25 citations92
US6703282B1Mar 9, 2004
Method of reducing NMOS device current degradation via formation of an HTO layer as an underlying component of a nitride-oxide sidewall spacer
TAIWAN SEMICONDUCTOR MFG12 citations69
US8779572B2Jul 15, 2014
On-chip heat spreader
TAIWAN SEMICONDUCTOR MFG2 citations62
US8609506B2Dec 17, 2013
On-chip heat spreader
TAIWAN SEMICONDUCTOR MFG2 citations62
US6376156B1Apr 23, 2002
Prevent defocus issue on wafer with tungsten coating on back-side
TAIWAN SEMICONDUCTOR MFG2 citations62
US7525177B2Apr 28, 2009
Controllable varactor within dummy substrate pattern
TAIWAN SEMICONDUCTOR MFG0 citations52