Inventor
CHUNG YOUNG SUK
KR41 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG YOUNG SUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
17 patentsUS6858919B2Feb 22, 2005
Semiconductor package
AMKOR TECHNOLOGY INC130 citations99
US6759737B2Jul 6, 2004
Semiconductor package including stacked chips with aligned input/output pads
AMKOR TECHNOLOGY INC105 citations98
US6448633B1Sep 10, 2002
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC258 citations98
US7977783B1Jul 12, 2011
Wafer level chip size package having redistribution layers
AMKOR TECHNOLOGY INC132 citations97
US6953988B2Oct 11, 2005
Semiconductor package
AMKOR TECHNOLOGY INC60 citations96
US6627976B1Sep 30, 2003
Leadframe for semiconductor package and mold for molding the same
AMKOR TECHNOLOGY INC64 citations96
US6525406B1Feb 25, 2003
Semiconductor device having increased moisture path and increased solder joint strength
AMKOR TECHNOLOGY INC69 citations95
US7944043B1May 17, 2011
Semiconductor device having improved contact interface reliability and method therefor
AMKOR TECHNOLOGY INC24 citations93
US7057280B2Jun 6, 2006
Leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC14 citations92
US7042068B2May 9, 2006
Leadframe and semiconductor package made using the leadframe
AMKOR TECHNOLOGY INC32 citations92
US6825062B2Nov 30, 2004
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC26 citations92
US6555899B1Apr 29, 2003
Semiconductor package leadframe assembly and method of manufacture
AMKOR TECHNOLOGY INC34 citations92
US7102208B1Sep 5, 2006
Leadframe and semiconductor package with improved solder joint strength
AMKOR TECHNOLOGY INC15 citations83
US6677662B1Jan 13, 2004
Clamp and heat block assembly for wire bonding a semiconductor package assembly
AMKOR TECHNOLOGY INC17 citations83
US9478517B2Oct 25, 2016
Electronic device package structure and method of fabricating the same
AMKOR TECHNOLOGY INC6 citations73
US7564122B2Jul 21, 2009
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
AMKOR TECHNOLOGY INC6 citations73
US9362210B2Jun 7, 2016
Leadframe and semiconductor package made using the leadframe
AMKOR TECHNOLOGY INC0 citations51
ISPEAKER CO LTD
10 patentsUSD879090SMar 24, 2020
Holder for smart device
ISPEAKER CO LTD69 citations98
US9661116B1May 23, 2017
Card-receptible semiautomatic slide case for mobile phone
ISPEAKER CO LTD71 citations98
USD958527SJul 26, 2022
Earphone case
ISPEAKER CO LTD29 citations94
USD958528SJul 26, 2022
Earphone case
ISPEAKER CO LTD22 citations94
USD925514SJul 20, 2021
Mobile phone case
ISPEAKER CO LTD23 citations94
USD872727SJan 14, 2020
Holder for smart device
ISPEAKER CO LTD27 citations94
USD837776SJan 8, 2019
Mobile phone case
ISPEAKER CO LTD23 citations94
USD830352SOct 9, 2018
Mobile phone case
ISPEAKER CO LTD47 citations94
US10511342B1Dec 17, 2019
Cell phone case with card storage capability
ISPEAKER CO LTD6 citations73
US10256860B2Apr 9, 2019
Card storage mobile phone case
ISPEAKER CO LTD2 citations73
SAMSUNG ELECTRONICS CO LTD
6 patentsUS7325332B2Feb 5, 2008
Clothing dryer
SAMSUNG ELECTRONICS CO LTD22 citations93
US7062863B2Jun 20, 2006
Washing machine and method of controlling drying process thereof
SAMSUNG ELECTRONICS CO LTD32 citations93
US8347523B2Jan 8, 2013
Clothing dryer
SAMSUNG ELECTRONICS CO LTD15 citations84
US7765839B2Aug 3, 2010
Drum type washer and door
SAMSUNG ELECTRONICS CO LTD9 citations84
US7644516B2Jan 12, 2010
Clothes drying machine
SAMSUNG ELECTRONICS CO LTD4 citations63
US7353624B2Apr 8, 2008
Clothing drying machine and method for sensing dryness level using the same
SAMSUNG ELECTRONICS CO LTD3 citations56