Inventor
KIM KI-NAM
KR161 patents
⚠️ This page may combine multiple inventors who share the name “KIM KI-NAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
43 patentsUS6297090B1Oct 2, 2001
Method for fabricating a high-density semiconductor memory device
SAMSUNG ELECTRONICS CO LTD169 citations99
US7542350B2Jun 2, 2009
Methods of restoring data in flash memory devices and related flash memory device memory systems
SAMSUNG ELECTRONICS CO LTD61 citations98
US7042760B2May 9, 2006
Phase-change memory and method having restore function
SAMSUNG ELECTRONICS CO LTD67 citations98
US6388281B1May 14, 2002
Triple metal line 1T/1C ferroelectric memory device and method for fabrication thereof
SAMSUNG ELECTRONICS CO LTD75 citations96
US7675783B2Mar 9, 2010
Nonvolatile memory device and driving method thereof
SAMSUNG ELECTRONICS CO LTD47 citations94
US6613621B2Sep 2, 2003
Methods of forming self-aligned contact pads using a damascene gate process
SAMSUNG ELECTRONICS CO LTD71 citations94
US6133116AOct 17, 2000
Methods of forming trench isolation regions having conductive shields therein
SAMSUNG ELECTRONICS CO LTD72 citations94
US7692970B2Apr 6, 2010
Flash memory devices that utilize age-based verify voltages to increase data reliability and methods of operating same
SAMSUNG ELECTRONICS CO LTD37 citations93
US7551480B2Jun 23, 2009
Multi-bit flash memory device and memory cell array
SAMSUNG ELECTRONICS CO LTD13 citations93
US7508732B2Mar 24, 2009
Multi-bit flash memory device including memory cells storing different numbers of bits
SAMSUNG ELECTRONICS CO LTD29 citations93
US7106617B2Sep 12, 2006
Ferroelectric memory devices having a plate line control circuit and methods for operating the same
SAMSUNG ELECTRONICS CO LTD14 citations93
US6737694B2May 18, 2004
Ferroelectric memory device and method of forming the same
SAMSUNG ELECTRONICS CO LTD39 citations93
US6713310B2Mar 30, 2004
Ferroelectric memory device using via etch-stop layer and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD18 citations93
US6420744B1Jul 16, 2002
Ferroelectric capacitor and method for fabricating ferroelectric capacitor
SAMSUNG ELECTRONICS CO LTD34 citations93
US6242332B1Jun 5, 2001
Method for forming self-aligned contact
SAMSUNG ELECTRONICS CO LTD26 citations93
US6037215AMar 14, 2000
Fabricating methods including capacitors on capping layer
SAMSUNG ELECTRONICS CO LTD18 citations93
US5895947AApr 20, 1999
Intergrated circuit memory devices including capacitors on capping layer
SAMSUNG ELECTRONICS CO LTD36 citations93
US7701771B2Apr 20, 2010
Memory device including 3-dimensionally arranged memory cell transistors and methods of operating the same
SAMSUNG ELECTRONICS CO LTD33 citations92
US7164598B2Jan 16, 2007
Methods of operating magnetic random access memory device using spin injection and related devices
SAMSUNG ELECTRONICS CO LTD25 citations92
US6979881B2Dec 27, 2005
Ferroelectric integrated circuit devices having an oxygen penetration path
SAMSUNG ELECTRONICS CO LTD16 citations92
US6961271B2Nov 1, 2005
Memory device in which memory cells having complementary data are arranged
SAMSUNG ELECTRONICS CO LTD41 citations92
US6844583B2Jan 18, 2005
Ferroelectric memory devices having expanded plate lines
SAMSUNG ELECTRONICS CO LTD13 citations92
US6836019B2Dec 28, 2004
Semiconductor device having multilayer interconnection structure and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD17 citations92
US6787906B1Sep 7, 2004
Bit line pad and borderless contact on bit line stud with localized etch stop layer formed in an undermined region
SAMSUNG ELECTRONICS CO LTD36 citations92
US6764941B2Jul 20, 2004
Bit line landing pad and borderless contact on bit line stud with localized etch stop layer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD33 citations92
US6562697B1May 13, 2003
Methods of implanting ions into different active areas to provide active areas having increased ion concentrations adjacent to isolation structures
SAMSUNG ELECTRONICS CO LTD22 citations92
US6518671B1Feb 11, 2003
Bit line landing pad and borderless contact on bit line stud with localized etch stop layer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD18 citations92
US6515323B1Feb 4, 2003
Ferroelectric memory device having improved ferroelectric characteristics
SAMSUNG ELECTRONICS CO LTD39 citations92
US6404001B2Jun 11, 2002
Multilevel conductive interconnections including capacitor electrodes for integrated circuit devices
SAMSUNG ELECTRONICS CO LTD36 citations92
US6350649B1Feb 26, 2002
Bit line landing pad and borderless contact on bit line stud with etch stop layer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD48 citations92
US6262446B1Jul 17, 2001
Methods of forming multilevel conductive interconnections including capacitor electrodes for integrated circuit devices
SAMSUNG ELECTRONICS CO LTD33 citations92
US6198651B1Mar 6, 2001
Ferroelectric memory devices which utilize boosted plate line voltages to improve reading reliability and methods of operating same
SAMSUNG ELECTRONICS CO LTD31 citations92
US6172386B1Jan 9, 2001
Ferroelectric memory device
SAMSUNG ELECTRONICS CO LTD18 citations92
US6391736B1May 21, 2002
Method for fabricating a capacitor of a semiconductor device and a capacitor made thereby
SAMSUNG ELECTRONICS CO LTD31 citations91
US11322578B2May 3, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations84
US8026504B2Sep 27, 2011
Semiconductor device and method of forming the same
SAMSUNG ELECTRONICS CO LTD7 citations84
US7986560B2Jul 26, 2011
Flash memory devices that utilize age-based verify voltages to increase data reliability and methods of operating same
SAMSUNG ELECTRONICS CO LTD15 citations84
US7672166B2Mar 2, 2010
Method of programming in a non-volatile memory device and non-volatile memory device for performing the same
SAMSUNG ELECTRONICS CO LTD17 citations84
US7626228B2Dec 1, 2009
NAND-type non-volatile memory devices having a stacked structure
SAMSUNG ELECTRONICS CO LTD18 citations84
US7535761B2May 19, 2009
Flash memory device capable of preventing coupling effect and program method thereof
SAMSUNG ELECTRONICS CO LTD15 citations84
US7518909B2Apr 14, 2009
Non-volatile memory device adapted to reduce coupling effect between storage elements and related methods
SAMSUNG ELECTRONICS CO LTD8 citations84
US7511297B2Mar 31, 2009
Phase change memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD17 citations84
US7411241B2Aug 12, 2008
Vertical type nanotube semiconductor device
SAMSUNG ELECTRONICS CO LTD15 citations84
SAMSUNG DISPLAY CO LTD
2 patentsSAMUNG ELECTRONICS CO LTD
1 patentSAMSUNG ELECTRIC
1 patentJI HO-CHUL
1 patentELECTRONICS & TELECOMMUNICATIONS RES INST
1 patentHYUNDAI MOTOR CO LTD
1 patentShowing the top 50 of 161 patents by PatentIndex Score.