Inventor
BEN-TZUR MIRA
US14 patents
Patents
14 patentsUS7026235B1Apr 11, 2006
Dual-damascene process and associated floating metal structures
CYPRESS SEMICONDUCTOR CORP23 citations92
US6903002B1Jun 7, 2005
Low-k dielectric layer with air gaps
CYPRESS SEMICONDUCTOR CORP16 citations83
US6841878B1Jan 11, 2005
Integrated circuit with improved RC delay
CYPRESS SEMICONDUCTOR CORP6 citations73
US6660661B1Dec 9, 2003
Integrated circuit with improved RC delay
CYPRESS SEMICONDUCTOR CORP8 citations73
US6774033B1Aug 10, 2004
Metal stack for local interconnect layer
CYPRESS SEMICONDUCTOR CORP11 citations72
US6835616B1Dec 28, 2004
Method of forming a floating metal structure in an integrated circuit
CYPRESS SEMICONDUCTOR CORP8 citations71
US6713831B1Mar 30, 2004
Borderless contact architecture
CYPRESS SEMICONDUCTOR CORP12 citations69
US6911395B1Jun 28, 2005
Method of making borderless contacts in an integrated circuit
CYPRESS SEMICONDUCTOR CORP8 citations67
US6844235B1Jan 18, 2005
Reticle repeater monitor wafer and method for verifying reticles
CYPRESS SEMICONDUCTOR CORP3 citations60
US7227212B1Jun 5, 2007
Method of forming a floating metal structure in an integrated circuit
CYPRESS SEMICONDUCTOR CORP4 citations59
US6977217B1Dec 20, 2005
Aluminum-filled via structure with barrier layer
CYPRESS SEMICONDUCTOR CORP4 citations58
US7018942B1Mar 28, 2006
Integrated circuit with improved RC delay
CYPRESS SEMICONDUCTOR CORP0 citations52
US7192867B1Mar 20, 2007
Protection of low-k dielectric in a passivation level
CYPRESS SEMICONDUCTOR CORP1 citations44
US6939792B1Sep 6, 2005
Low-k dielectric layer with overlying adhesion layer
CYPRESS SEMICONDUCTOR CORP1 citations42