Inventor
HATADA KENZOU
JP4 patents
Patents
4 patentsUS6005401ADec 21, 1999
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD140 citations98
US5945834AAug 31, 1999
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD160 citations98
US6323663B1Nov 27, 2001
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD37 citations92
US5037780AAug 6, 1991
Method for attaching semiconductors to a transparent substrate using a light-curable resin
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD26 citations89