Inventor
TSENG YUAN-PING
TW11 patents
⚠️ This page may combine multiple inventors who share the name “TSENG YUAN-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
6 patentsUS6534853B2Mar 18, 2003
Semiconductor wafer designed to avoid probed marks while testing
CHIPMOS TECHNOLOGIES INC141 citations97
US6395622B1May 28, 2002
Manufacturing process of semiconductor devices
CHIPMOS TECHNOLOGIES INC16 citations83
US7140101B2Nov 28, 2006
Method for fabricating anisotropic conductive substrate
CHIPMOS TECHNOLOGIES INC4 citations62
US6605480B2Aug 12, 2003
Wafer level packaging for making flip-chips
CHIPMOS TECHNOLOGIES INC4 citations60
US6751760B2Jun 15, 2004
Method and system for performing memory repair analysis
CHIPMOS TECHNOLOGIES INC3 citations58
US7005054B2Feb 28, 2006
Method for manufacturing probes of a probe card
CHIPMOS TECHNOLOGIES INC0 citations48
CHIPMOS TECHNOLOGIES BERMUDA
4 patentsUS6853205B1Feb 8, 2005
Probe card assembly
CHIPMOS TECHNOLOGIES BERMUDA41 citations92
US6621710B1Sep 16, 2003
Modular probe card assembly
CHIPMOS TECHNOLOGIES BERMUDA29 citations92
US6686615B1Feb 3, 2004
Flip-chip type semiconductor device for reducing signal skew
CHIPMOS TECHNOLOGIES BERMUDA35 citations89
US6812720B1Nov 2, 2004
Modularized probe card with coaxial transmitters
CHIPMOS TECHNOLOGIES BERMUDA11 citations73