Inventor

WOO HYUN-JONG

KR2 patents

⚠️ This page may combine multiple inventors who share the name “WOO HYUN-JONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US7759795B2Jul 20, 2010

Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD2 citations58

AGENCY DEFENSE DEV

1 patent

US12372558B2Jul 29, 2025

Device and method for measuring voltage by using optical element

AGENCY DEFENSE DEV0 citations42