Inventor
TSAI Chang Chin
TW8 patents
Patents
8 patentsUS11081413B2Aug 3, 2021
Semiconductor package with inner and outer cavities
ADVANCED SEMICONDUCTOR ENG3 citations69
US10770624B2Sep 8, 2020
Semiconductor device package, optical package, and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations61
US12094995B2Sep 17, 2024
Optical device including lid having first and second cavity with inclined sidewalls
ADVANCED SEMICONDUCTOR ENG0 citations60
US11430906B2Aug 30, 2022
Optical device including lid having first and second cavity with inclined sidewalls
ADVANCED SEMICONDUCTOR ENG0 citations60
US11410915B2Aug 9, 2022
Semiconductor package structure including an encapsulant having a cavity exposing an interposer
ADVANCED SEMICONDUCTOR ENG0 citations59
US11888081B2Jan 30, 2024
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations58
US11551963B2Jan 10, 2023
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations56
US10453760B2Oct 22, 2019
Lid array panel, package with lid and method of making the same
ADVANCED SEMICONDUCTOR ENG0 citations49