Inventor

HOURANI RAMI

US58 patents

⚠️ This page may combine multiple inventors who share the name “HOURANI RAMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOURANI RAMI

INTEL CORP

Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (BEOL) interconnects

Via blocking layer

Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions

Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Self-aligned via

Microelectronic conductive routes and methods of making the same

Selective deposition utilizing sacrificial blocking layers for semiconductor devices

Lined photobucket structure for back end of line (BEOL) interconnect formation

Selective gate spacers for semiconductor devices

Selective gate spacers for semiconductor devices

Bottom-up selective dielectric cross-linking to prevent via landing shorts

Method for creating alternate hardmask cap interconnect structure with increased overlay margin

Self-aligned gate endcap (SAGE) architectures without fin end gap

Non-lithographically patterned directed self assembly alignment promotion layers

Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication

Contact over active gate structures with metal oxide layers to inhibit shorting

Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Differential hardmasks for modulation of electrobucket sensitivity

Grating replication using helmets and topographically-selective deposition

Techniques for forming gate structures for transistors arranged in a stacked configuration on a single fin structure

Selective gate spacers for semiconductor devices

Grating replication using helmets and topographically-selective deposition

Differential hardmasks for modulation of electrobucket sensitivity

Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication

Photobucket floor colors with selective grafting

Differentiated molecular domains for selective hardmask fabrication and structures resulting therefrom

Lined photobucket structure for back end of line (BEOL) interconnect formation

Multifunctional molecules for selective polymer formation on conductive surfaces and structures resulting therefrom

Contact over active gate structures with metal oxide-caped contacts to inhibit shorting

Contact over active gate structures with metal oxide-caped contacts to inhibit shorting

Etch stop layer-based approaches for conductive via fabrication and structures resulting therefrom

Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom

Self-aligned repeatedly stackable 3D vertical RRAM

Vertical thin film transistor structures with localized gate dielectric

Selective deposition utilizing sacrificial blocking layers for semiconductor devices

Via blocking layer

Via blocking layer

APPLIED MATERIALS INC

Methods for increasing the density of high-index nanoimprint lithography films

Methods, systems, and apparatus for inkjet printing self-assembled monoloayer (SAM) structures on substrates

Optical device having structural and refractive index gradation, and method of fabricating the same

High refractive index imprint compositions and materials and processes for making the same

Total or local thickness variation for optical devices

Total or local thickness variation for optical devices

Imprint compositions with passivated nanoparticles and materials and processes for making the same

High index edge blackening material

Methods for increasing the density of high-index nanoimprint lithography films

Edge blackening for optical devices

Edge blackening for optical devices

Patterning of optical device films via inkjet soluble mask, deposition, and lift-off

Methods for encapsulating silver mirrors on optical structures