Inventor

SCHENKER RICHARD E

US39 patents

⚠️ This page may combine multiple inventors who share the name “SCHENKER RICHARD E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHENKER RICHARD E

INTEL CORP

Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnects

Advanced lithography and self-assembled devices

Backside contacts for semiconductor devices

Self-aligned hard masks with converted liners

Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme

Advanced lithography and self-assembled devices

Stacked forksheet transistors

Method and apparatus that compensates for phase shift mask manufacturing defects

Advanced lithography and self-assembled devices

Advanced lithography and self-assembled devices

Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Structure and method to self align via to top and bottom of tight pitch metal interconnect layers

Method and structure to contact tight pitch conductive layers with guided vias

Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects

Methods for forming interconnect layers having tight pitch interconnect structures

Passivating silicide-based approaches for conductive via fabrication and structures resulting therefrom

Method for creating alternate hardmask cap interconnect structure with increased overlay margin

Methods of forming parallel wires of different metal materials through double patterning and fill techniques

Colored gratings in microelectronic structures

Contact over active gate structures with metal oxide layers to inhibit shorting

Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Maskless air gap enabled by a single damascene process

Materials and layout design options for DSA on transition regions over active die

Damascene plug and tab patterning with photobuckets

Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects

Damascene plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects

Self-aligned via below subtractively patterned interconnect

Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication

Contact over active gate structures with metal oxide-caped contacts to inhibit shorting

Backside contacts for semiconductor devices

1D vertical edge blocking (VEB) via and plug

Contact over active gate structures with metal oxide-caped contacts to inhibit shorting

1D vertical edge blocking (VEB) via and plug

Directed self-assembly enabled subtractive metal patterning

Directed self-assembly structures and techniques

Self-aligned patterning with colored blocking and structures resulting therefrom

Methods and masks for line end formation for back end of line (BEOL) interconnects and structures resulting therefrom

BRISTOL ROBERT L

Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects

TAHOE RES LTD

Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects