Inventor
WANG TZU-YU
US53 patents
⚠️ This page may combine multiple inventors who share the name “WANG TZU-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HONEYWELL INT INC
18 patentsUS6606199B2Aug 12, 2003
Graded thickness optical element and method of manufacture therefor
HONEYWELL INT INC36 citations93
US7546772B2Jun 16, 2009
Piezoresistive pressure sensor
HONEYWELL INT INC20 citations92
US7216048B2May 8, 2007
Calibrated pressure sensor
HONEYWELL INT INC30 citations92
US7168675B2Jan 30, 2007
Media isolated electrostatically actuated valve
HONEYWELL INT INC22 citations92
US7517201B2Apr 14, 2009
Asymmetric dual diaphragm pump
HONEYWELL INT INC13 citations84
US6991213B2Jan 31, 2006
Dual diaphragm valve
HONEYWELL INT INC11 citations84
US6901807B1Jun 7, 2005
Positive and negative pressure sensor
HONEYWELL INT INC12 citations84
US6886410B1May 3, 2005
Modified dual diaphragm pressure sensor
HONEYWELL INT INC12 citations84
US6693934B2Feb 17, 2004
Wavelength division multiplexed vertical cavity surface emitting laser array
HONEYWELL INT INC16 citations84
US8007704B2Aug 30, 2011
Insert molded actuator components
HONEYWELL INT INC15 citations82
US7222639B2May 29, 2007
Electrostatically actuated gas valve
HONEYWELL INT INC12 citations82
US7328882B2Feb 12, 2008
Microfluidic modulating valve
HONEYWELL INT INC8 citations73
US11274957B2Mar 15, 2022
Method to calibrate disposable cartridge cuvette thickness in-situ
HONEYWELL INT INC0 citations63
US7877862B2Feb 1, 2011
Weldless mesotube grid holder
HONEYWELL INT INC2 citations63
US7100453B2Sep 5, 2006
Modified dual diaphragm pressure sensor
HONEYWELL INT INC5 citations63
US7331239B1Feb 19, 2008
Self calibrating dual diaphragm pressure sensor
HONEYWELL INT INC5 citations62
US10139263B2Nov 27, 2018
Method to calibrate disposable cartridge cuvette thickness in-situ
HONEYWELL INT INC0 citations52
US7467779B2Dec 23, 2008
Microfluidic modulating valve
HONEYWELL INT INC1 citations51
FINISAR CORP
10 patentsUS7564887B2Jul 21, 2009
Long wavelength vertical cavity surface emitting lasers
FINISAR CORP60 citations98
US6813293B2Nov 2, 2004
Long wavelength VCSEL with tunnel junction, and implant
FINISAR CORP25 citations93
US6798806B1Sep 28, 2004
Hybrid mirror VCSELs
FINISAR CORP24 citations93
US7031363B2Apr 18, 2006
Long wavelength VCSEL device processing
FINISAR CORP39 citations92
US7054345B2May 30, 2006
Enhanced lateral oxidation
FINISAR CORP20 citations91
US7433381B2Oct 7, 2008
InP based long wavelength VCSEL
FINISAR CORP11 citations83
US7286584B2Oct 23, 2007
Carrier bonded 1550 nm VCSEL with InP substrate removal
FINISAR CORP11 citations83
US7110427B2Sep 19, 2006
Hybrid mirror VCSEL
FINISAR CORP5 citations74
US7860143B2Dec 28, 2010
Metal-assisted DBRs for thermal management in VCSELs
FINISAR CORP2 citations62
US7157730B2Jan 2, 2007
Angled wafer rotating ion implantation
FINISAR CORP1 citations52
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS9589857B2Mar 7, 2017
Interposer test structures and methods
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10090213B2Oct 2, 2018
Interposer test structures and methods
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10056347B2Aug 21, 2018
Bump structure for yield improvement
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9691840B2Jun 27, 2017
Cylindrical embedded capacitors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11682593B2Jun 20, 2023
Interposer test structures and methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10734295B2Aug 4, 2020
Interposer test structures and methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9760670B2Sep 12, 2017
Semiconductor device design methods and conductive bump pattern enhancement methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9588505B2Mar 7, 2017
Near non-adaptive virtual metrology and chamber control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
4 patentsUS9337118B2May 10, 2016
Stress buffer structures in a mounting structure of a semiconductor device
TAIWAN SEMICONDUCTOR MFG5 citations84
US8906798B2Dec 9, 2014
Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor device
TAIWAN SEMICONDUCTOR MFG5 citations84
US8354750B2Jan 15, 2013
Stress buffer structures in a mounting structure of a semiconductor device
TAIWAN SEMICONDUCTOR MFG9 citations84
US9372951B2Jun 21, 2016
Semiconductor device design methods and conductive bump pattern enhancement methods
TAIWAN SEMICONDUCTOR MFG4 citations73
WANG TZU-YU
3 patentsCHIU TZU-WEI
2 patentsLIU TZUAN-HORNG
1 patentMACRONIX INT CO LTD
1 patentSU AN-JHIH
1 patentBARDELL RON
1 patentKO FRANCIS
1 patentShowing the top 50 of 53 patents by PatentIndex Score.