Inventor
KIM HYEONG-SEOB
KR15 patents
⚠️ This page may combine multiple inventors who share the name “KIM HYEONG-SEOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS6982487B2Jan 3, 2006
Wafer level package and multi-package stack
SAMSUNG ELECTRONICS CO LTD145 citations98
US8901750B2Dec 2, 2014
Semiconductor package including multiple chips and separate groups of leads
SAMSUNG ELECTRONICS CO LTD12 citations92
US7335592B2Feb 26, 2008
Wafer level package, multi-package stack, and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US7105919B2Sep 12, 2006
Semiconductor package having ultra-thin thickness and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD24 citations92
US11626373B2Apr 11, 2023
Semiconductor packages including antenna pattern
SAMSUNG ELECTRONICS CO LTD2 citations72
US5898226AApr 27, 1999
Semiconductor chip having a bonding window smaller than a wire ball
SAMSUNG ELECTRONICS CO LTD16 citations72
US7420129B2Sep 2, 2008
Semiconductor package including a semiconductor device, and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations62
US12261135B2Mar 25, 2025
Semiconductor packages including antenna pattern
SAMSUNG ELECTRONICS CO LTD0 citations61
US9455217B2Sep 27, 2016
Semiconductor package including multiple chips and separate groups of leads
SAMSUNG ELECTRONICS CO LTD0 citations51
US8026616B2Sep 27, 2011
Printed circuit board, semiconductor package, card apparatus, and system
SAMSUNG ELECTRONICS CO LTD0 citations42