Inventor
CHUNG TAE-GYEONG
KR21 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG TAE-GYEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS6982487B2Jan 3, 2006
Wafer level package and multi-package stack
SAMSUNG ELECTRONICS CO LTD145 citations98
US8736035B2May 27, 2014
Semiconductor package and method of forming the same
SAMSUNG ELECTRONICS CO LTD26 citations92
US8022555B2Sep 20, 2011
Semiconductor package and method of forming the same
SAMSUNG ELECTRONICS CO LTD34 citations92
US7485955B2Feb 3, 2009
Semiconductor package having step type die and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD30 citations92
US7335592B2Feb 26, 2008
Wafer level package, multi-package stack, and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US6857470B2Feb 22, 2005
Stacked chip package with heat transfer wires
SAMSUNG ELECTRONICS CO LTD38 citations92
US6340838B1Jan 22, 2002
Apparatus and method for containing semiconductor chips to identify known good dies
SAMSUNG ELECTRONICS CO LTD33 citations92
US5894107AApr 13, 1999
Chip-size package (CSP) using a multi-layer laminated lead frame
SAMSUNG ELECTRONICS CO LTD47 citations91
US5660318AAug 26, 1997
Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus
SAMSUNG ELECTRONICS CO LTD29 citations89
US6812578B2Nov 2, 2004
Semiconductor device bonding pad resistant to stress and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD18 citations84
US7368811B2May 6, 2008
Multi-chip package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD16 citations83
US6943438B2Sep 13, 2005
Memory card having a control chip
SAMSUNG ELECTRONICS CO LTD4 citations63
US7923291B2Apr 12, 2011
Method of fabricating electronic device having stacked chips
SAMSUNG ELECTRONICS CO LTD0 citations51
US7821139B2Oct 26, 2010
Flip-chip assembly and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations51
HWANG TAE-JOO
4 patentsUS8421244B2Apr 16, 2013
Semiconductor package and method of forming the same
HWANG TAE-JOO7 citations82
US9484292B2Nov 1, 2016
Semiconductor package and method of forming the same
HWANG TAE-JOO3 citations71
US9685400B2Jun 20, 2017
Semiconductor package and method of forming the same
HWANG TAE-JOO1 citations61
US8129221B2Mar 6, 2012
Semiconductor package and method of forming the same
HWANG TAE-JOO1 citations51