Inventor

WANG MENG-JEN

TW54 patents

⚠️ This page may combine multiple inventors who share the name “WANG MENG-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG MENG-JEN

ADVANCED SEMICONDUCTOR ENG

Package and the method for making the same, and a stacked package

Face-to-face multi-chip flip-chip package

Method for forming vias in a substrate

Method for forming vias in a substrate

Semiconductor package with a flip chip on a solder-resist leadframe

Multi-package module with heat spreader

Multichip package

Micro-electro-mechanical-system package and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Quad flat flip chip package and leadframe thereof

Flip-chip type quad flat package and leadframe

Method for making flip chip on leadframe package

Flip chip package with anti-floating structure

Method of fabricating flip chip ball grid array package

Multi-chips stacked package

Semiconductor device package and method for manufacturing the same

Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same

Fan-out ball grid array package structure and process for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor structure, method for manufacturing semiconductor structure and semiconductor package

Chip package structure

Optical device package with compatible lid and carrier

Optical device package

Quad flat flip chip packaging process and leadframe therefor

Semiconductor device package and method for manufacturing the same

Recyclable stamp device and recyclable stamp process for wafer bond

Package structure and method for manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via

Microelectromechanical system package and the method for manufacturing the same

Semiconductor package device

WANG MENG-JEN

Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same

Semiconductor package structure and manufacturing process thereof

Semiconductor structure having conductive vias and method for manufacturing the same

Semiconductor structure and method for making the same

Package process of stacked type semiconductor device package structure

Semiconductor structure and method for making the same

Method for forming a via in a substrate

Method for forming vias in a semiconductor substrate and a semiconductor device having the semiconductor substrate

Method for forming vias in a substrate

Method for forming a via in a substrate and substrate with a via

Method for forming vias in a substrate

YEE KUO-CHUNG

Method for making a stackable package

WANG MENG JEN

Microelectromechanical system package

Cheng bing-hong

Semiconductor device and semiconductor package having the same

CHIU CHI-TSUNG

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via