Inventor
YAGNAMURTHY NAGA SIVAKUMAR
AZ4 patents
Patents
4 patentsUS10231338B2Mar 12, 2019
Methods of forming trenches in packages structures and structures formed thereby
INTEL CORP2 citations69
US10957656B2Mar 23, 2021
Integrated circuit packages with patterned protective material
INTEL CORP2 citations66
US10985080B2Apr 20, 2021
Electronic package that includes lamination layer
INTEL CORP0 citations59
US11327050B2May 10, 2022
Mechanical failure monitoring, detection, and classification in electronic assemblies
INTEL CORP1 citations55