Inventor
NIKKEL ERIC L
US30 patents
⚠️ This page may combine multiple inventors who share the name “NIKKEL ERIC L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
25 patentsUS6861277B1Mar 1, 2005
Method of forming MEMS device
HEWLETT PACKARD DEVELOPMENT CO394 citations98
US6672712B1Jan 6, 2004
Slotted substrates and methods and systems for forming same
HEWLETT PACKARD DEVELOPMENT CO42 citations95
US7199916B2Apr 3, 2007
Light modulator device
HEWLETT PACKARD DEVELOPMENT CO28 citations92
US7040735B2May 9, 2006
Slotted substrates and methods and systems for forming same
HEWLETT PACKARD DEVELOPMENT CO12 citations92
US7508040B2Mar 24, 2009
Micro electrical mechanical systems pressure sensor
HEWLETT PACKARD DEVELOPMENT CO44 citations91
US7273693B2Sep 25, 2007
Method for forming a planar mirror using a sacrificial oxide
HEWLETT PACKARD DEVELOPMENT CO23 citations91
US6917459B2Jul 12, 2005
MEMS device and method of forming MEMS device
HEWLETT PACKARD DEVELOPMENT CO35 citations90
US7733553B2Jun 8, 2010
Light modulator with tunable optical state
HEWLETT PACKARD DEVELOPMENT CO15 citations83
US7447891B2Nov 4, 2008
Light modulator with concentric control-electrode structure
HEWLETT PACKARD DEVELOPMENT CO16 citations83
US7079301B2Jul 18, 2006
MEMS device and method of forming MEMS device
HEWLETT PACKARD DEVELOPMENT CO12 citations80
US7310175B2Dec 18, 2007
MEMS device and method of forming MEMS device
HEWLETT PACKARD DEVELOPMENT CO9 citations73
US7198726B2Apr 3, 2007
Slotted substrates and methods and systems for forming same
HEWLETT PACKARD DEVELOPMENT CO8 citations73
US6914709B2Jul 5, 2005
MEMS device and method of forming MEMS device
HEWLETT PACKARD DEVELOPMENT CO9 citations70
US6818138B2Nov 16, 2004
Slotted substrate and slotting process
HEWLETT PACKARD DEVELOPMENT CO8 citations68
US7695104B2Apr 13, 2010
Slotted substrates and methods and systems for forming same
HEWLETT PACKARD DEVELOPMENT CO3 citations62
US7471441B1Dec 30, 2008
Flexures
HEWLETT PACKARD DEVELOPMENT CO3 citations62
US7741751B2Jun 22, 2010
MEMS device having distance stops
HEWLETT PACKARD DEVELOPMENT CO2 citations61
US7105456B2Sep 12, 2006
Methods for controlling feature dimensions in crystalline substrates
HEWLETT PACKARD DEVELOPMENT CO3 citations61
US6979585B2Dec 27, 2005
Micro-electromechanical system
HEWLETT PACKARD DEVELOPMENT CO5 citations61
US7874654B2Jan 25, 2011
Fluid manifold for fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO2 citations58
US11117376B2Sep 14, 2021
Printhead assembly
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US7571650B2Aug 11, 2009
Piezo resistive pressure sensor
HEWLETT PACKARD DEVELOPMENT CO2 citations55
US10557567B2Feb 11, 2020
Fluidic micro electromechanical system
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10342140B2Jul 2, 2019
Printed circuit board to molded compound interface
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10195852B2Feb 5, 2019
Printhead assembly
HEWLETT PACKARD DEVELOPMENT CO0 citations47