P

Inventor

NIKKEL ERIC L

US30 patents
⚠️ This page may combine multiple inventors who share the name “NIKKEL ERIC L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD DEVELOPMENT CO

25 patents
US6861277B1Mar 1, 2005

Method of forming MEMS device

HEWLETT PACKARD DEVELOPMENT CO394 citations98
US6672712B1Jan 6, 2004

Slotted substrates and methods and systems for forming same

HEWLETT PACKARD DEVELOPMENT CO42 citations95
US7199916B2Apr 3, 2007

Light modulator device

HEWLETT PACKARD DEVELOPMENT CO28 citations92
US7040735B2May 9, 2006

Slotted substrates and methods and systems for forming same

HEWLETT PACKARD DEVELOPMENT CO12 citations92
US7508040B2Mar 24, 2009

Micro electrical mechanical systems pressure sensor

HEWLETT PACKARD DEVELOPMENT CO44 citations91
US7273693B2Sep 25, 2007

Method for forming a planar mirror using a sacrificial oxide

HEWLETT PACKARD DEVELOPMENT CO23 citations91
US6917459B2Jul 12, 2005

MEMS device and method of forming MEMS device

HEWLETT PACKARD DEVELOPMENT CO35 citations90
US7733553B2Jun 8, 2010

Light modulator with tunable optical state

HEWLETT PACKARD DEVELOPMENT CO15 citations83
US7447891B2Nov 4, 2008

Light modulator with concentric control-electrode structure

HEWLETT PACKARD DEVELOPMENT CO16 citations83
US7079301B2Jul 18, 2006

MEMS device and method of forming MEMS device

HEWLETT PACKARD DEVELOPMENT CO12 citations80
US7310175B2Dec 18, 2007

MEMS device and method of forming MEMS device

HEWLETT PACKARD DEVELOPMENT CO9 citations73
US7198726B2Apr 3, 2007

Slotted substrates and methods and systems for forming same

HEWLETT PACKARD DEVELOPMENT CO8 citations73
US6914709B2Jul 5, 2005

MEMS device and method of forming MEMS device

HEWLETT PACKARD DEVELOPMENT CO9 citations70
US6818138B2Nov 16, 2004

Slotted substrate and slotting process

HEWLETT PACKARD DEVELOPMENT CO8 citations68
US7695104B2Apr 13, 2010

Slotted substrates and methods and systems for forming same

HEWLETT PACKARD DEVELOPMENT CO3 citations62
US7471441B1Dec 30, 2008

Flexures

HEWLETT PACKARD DEVELOPMENT CO3 citations62
US7741751B2Jun 22, 2010

MEMS device having distance stops

HEWLETT PACKARD DEVELOPMENT CO2 citations61
US7105456B2Sep 12, 2006

Methods for controlling feature dimensions in crystalline substrates

HEWLETT PACKARD DEVELOPMENT CO3 citations61
US6979585B2Dec 27, 2005

Micro-electromechanical system

HEWLETT PACKARD DEVELOPMENT CO5 citations61
US7874654B2Jan 25, 2011

Fluid manifold for fluid ejection device

HEWLETT PACKARD DEVELOPMENT CO2 citations58
US11117376B2Sep 14, 2021

Printhead assembly

HEWLETT PACKARD DEVELOPMENT CO0 citations56
US7571650B2Aug 11, 2009

Piezo resistive pressure sensor

HEWLETT PACKARD DEVELOPMENT CO2 citations55
US10557567B2Feb 11, 2020

Fluidic micro electromechanical system

HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10342140B2Jul 2, 2019

Printed circuit board to molded compound interface

HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10195852B2Feb 5, 2019

Printhead assembly

HEWLETT PACKARD DEVELOPMENT CO0 citations47

HEWLETT PACKARD CO

2 patents

VAN BROCKLIN ANDREW L

1 patent

RIVAS RIO

1 patent

LEITH STEVEN D

1 patent