Inventor
WAKASUGI YASUMASA
JP4 patents
Patents
4 patentsUS4698663AOct 6, 1987
Heatsink package for flip-chip IC
FUJITSU LTD125 citations96
US4742024AMay 3, 1988
Semiconductor device and method of producing semiconductor device
FUJITSU LTD37 citations92
US4803546AFeb 7, 1989
Heatsink package for flip-chip IC
FUJITSU LTD36 citations88
US4891344AJan 2, 1990
Low dielectric constant ceramic substrate
FUJITSU LTD1 citations51