Inventor · disambiguated record
S. Jay Chey
Also filed as: CHEY S J · CHEY S JAY
35 granted patents·4 pending applications·204 citations·filing 2000–2017
97Inventor score
Top patents by PatentIndex Score
39 records- 0192US8723534B2Methods and apparatus for detection of gaseous corrosive contaminantsCHEY S JAY·Filed 2011·Granted May 13, 2014·10 cites·18 claims
- 0291US7497366B2Global vacuum injection molded solder system and methodIBM·Filed 2007·Granted Mar 3, 2009·17 cites·1 claims
- 0390US7130141B2Assembly for thermal and/or thermally-assisted information processingHITACHI GLOBAL STORAGE TECH·Filed 2003·Granted Oct 31, 2006·31 cites·24 claims
- 0488US7029803B2Attenuating phase shift mask blank and photomaskIBM·Filed 2003·Granted Apr 18, 2006·45 cites·50 claims
- 0583US8933717B2Probe-on-substrateAUDETTE DAVID M·Filed 2012·Granted Jan 13, 2015·5 cites·23 claims
- 0681US8487304B2High performance compliant wafer test probeCHEY S JAY·Filed 2010·Granted Jul 16, 2013·5 cites·23 claims
- 0779US8949040B2Methods and apparatus for managing corrosion in buildingsCHEY S JAY·Filed 2011·Granted Feb 3, 2015·7 cites·19 claims
- 0878US9575040B2Methods and apparatus for detection of gaseous corrosive contaminantsIBM·Filed 2014·Granted Feb 21, 2017·2 cites·14 claims
- 0975US7417315B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2002·Granted Aug 26, 2008·12 cites·30 claims
- 1075US6653027B2Attenuated embedded phase shift photomask blanksIBM·Filed 2001·Granted Nov 25, 2003·12 cites·41 claims
- 1173US8241957B2Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingHOUGHAM GARETH GEOFFREY·Filed 2010·Granted Aug 14, 2012·2 cites·16 claims
- 1270US9057741B2Probe-on-substrateAUDETTE DAVID M·Filed 2012·Granted Jun 16, 2015·2 cites·25 claims
- 1369US6730445B2Attenuated embedded phase shift photomask blanksIBM·Filed 2002·Granted May 4, 2004·8 cites·21 claims
- 1467US9937124B2Microchip substance delivery devices having low-power electromechanical release mechanismsIBM·Filed 2014·Granted Apr 10, 2018·3 cites·20 claims
- 1567US8119206B2Negative coefficient of thermal expansion particlesHOUGHAM GARETH GEOFFREY·Filed 2009·Granted Feb 21, 2012·4 cites·10 claims
- 1666US7556979B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2007·Granted Jul 7, 2009·1 cites·7 claims
- 1765US7456640B2Structure for coupling probes of probe device to corresponding electrical contacts on product substrateIBM·Filed 2006·Granted Nov 25, 2008·6 cites·20 claims
- 1864US6858357B2Attenuated embedded phase shift photomask blanksIBM·Filed 2003·Granted Feb 22, 2005·5 cites·47 claims
- 1964US6682860B2Attenuated embedded phase shift photomask blanksIBM·Filed 2002·Granted Jan 27, 2004·7 cites·23 claims
- 2063US8852408B2Electrochemical liquid cell apparatusCHEY S JAY·Filed 2009·Granted Oct 7, 2014·2 cites·10 claims
- 2162US10697927B2Reconfigurable gas sensor architecture with a high sensitivity at low temperaturesIBM·Filed 2016·Granted Jun 30, 2020·0 cites·19 claims
- 2262US10697928B2Reconfigurable gas sensor architecture with a high sensitivity at low temperaturesIBM·Filed 2016·Granted Jun 30, 2020·0 cites·16 claims
- 2362US6350625B1Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereofIBM·Filed 2000·Granted Feb 26, 2002·6 cites·35 claims
- 2461US2011079632A1Multistack solder wafer fillingIBM·Filed 2009·Application pending·0 cites
- 2560US7883919B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2009·Granted Feb 8, 2011·0 cites·6 claims
- 2660US7784669B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2009·Granted Aug 31, 2010·1 cites·11 claims
- 2759US10670554B2Reconfigurable gas sensor architecture with a high sensitivity at low temperaturesIBM·Filed 2015·Granted Jun 2, 2020·0 cites·16 claims
- 2859US7703661B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2007·Granted Apr 27, 2010·1 cites·22 claims
- 2958US6928380B2Thermal measurements of electronic devices during operationIBM·Filed 2003·Granted Aug 9, 2005·8 cites·21 claims
- 3053US2012234902A1Multistack solder wafer fillingCHEY S JAY·Filed 2012·Application pending·0 cites
- 3152US7987591B2Method of forming silicon chicklet pedestalIBM·Filed 2009·Granted Aug 2, 2011·1 cites·11 claims
- 3251US8806740B2Silicon chicklet pedestalCHEY S JAY·Filed 2011·Granted Aug 19, 2014·0 cites·15 claims
- 3351US8595919B2Silicon chicklet pedestalCHEY S JAY·Filed 2011·Granted Dec 3, 2013·0 cites·10 claims
- 3450US11000474B2Microchip substance delivery devicesIBM·Filed 2017·Granted May 11, 2021·0 cites·14 claims
- 3549US6979518B2Attenuated embedded phase shift photomask blanksIBM·Filed 2003·Granted Dec 27, 2005·0 cites·21 claims
- 3649US2008014406A1Injection molded soldering head for high temperature application and method of making sameIBM·Filed 2006·Application pending·0 cites
- 3748US9335346B2High performance compliant wafer test probeCHEY S JAY·Filed 2012·Granted May 10, 2016·0 cites·20 claims
- 3846US7579069B2Negative coefficient of thermal expansion particles and method of forming the sameIBM·Filed 2003·Granted Aug 25, 2009·1 cites·4 claims
- 3946US2009051026A1Process for forming metal film and release layer on polymerIBM·Filed 2007·Application pending·0 cites
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