Inventor
SPEIDELL JAMES L
US33 patents
⚠️ This page may combine multiple inventors who share the name “SPEIDELL JAMES L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
30 patentsUS6657723B2Dec 2, 2003
Multimode planar spectrographs for wavelength demultiplexing and methods of fabrication
IBM128 citations96
US6429755B2Aug 6, 2002
Method for constructing an encapsulated MEMS band-pass filter for integrated circuits
IBM78 citations96
US6275122B1Aug 14, 2001
Encapsulated MEMS band-pass filter for integrated circuits
IBM72 citations96
US4551192ANov 5, 1985
Electrostatic or vacuum pinchuck formed with microcircuit lithography
IBM434 citations96
US4523971AJun 18, 1985
Programmable ion beam patterning system
IBM75 citations96
US6061114AMay 9, 2000
Alignment of liquid crystal layers
IBM71 citations95
US6020946AFeb 1, 2000
Dry processing for liquid-crystal displays using low energy ion bombardment
IBM83 citations95
US6384312B1May 7, 2002
Thermoelectric coolers with enhanced structured interfaces
IBM65 citations94
US5225926AJul 6, 1993
Durable optical elements fabricated from free standing polycrystalline diamond and non-hydrogenated amorphous diamond like carbon (dlc) thin films
IBM98 citations94
US6426241B1Jul 30, 2002
Method for forming three-dimensional circuitization and circuits formed
IBM39 citations93
US7497366B2Mar 3, 2009
Global vacuum injection molded solder system and method
IBM17 citations92
US6399406B2Jun 4, 2002
Encapsulated MEMS band-pass filter for integrated circuits and method of fabrication thereof
IBM44 citations91
US6262464B1Jul 17, 2001
Encapsulated MEMS brand-pass filter for integrated circuits
IBM23 citations91
US6798953B1Sep 28, 2004
Guides lithographically fabricated on semiconductor devices
IBM23 citations90
US6180291B1Jan 30, 2001
Static resistant reticle
IBM28 citations88
US7416104B2Aug 26, 2008
Rotational fill techniques for injection molding of solder
IBM14 citations84
US7410092B2Aug 12, 2008
Fill head for injection molding of solder
IBM10 citations84
US7410090B2Aug 12, 2008
Conductive bonding material fill techniques
IBM7 citations74
US6654089B2Nov 25, 2003
Maskless method and system for creating a dual-domain pattern on a diamond-like carbon alignment layer
IBM7 citations74
US5756236AMay 26, 1998
Fabrication of high resolution aluminum ablation masks
IBM11 citations74
US5289632AMar 1, 1994
Applying conductive lines to integrated circuits
IBM12 citations73
US4714831ADec 22, 1987
Spherical retarding grid analyzer
IBM10 citations71
US7784664B2Aug 31, 2010
Fill head for injection molding of solder
IBM2 citations63
US7784673B2Aug 31, 2010
Rotational fill techniques for injection molding of solder
IBM4 citations63
US6350625B1Feb 26, 2002
Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof
IBM6 citations63
US5321886AJun 21, 1994
Applying conductive lines to integrated circuits
IBM1 citations62
US5310967AMay 10, 1994
Applying conductive lines to integrated circuits
IBM3 citations62
US7669748B2Mar 2, 2010
Conductive bonding material fill techniques
IBM1 citations52
US11651973B2May 16, 2023
Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer
IBM0 citations51
US7694869B2Apr 13, 2010
Universal mold for injection molding of solder
IBM0 citations42