Inventor
CHAI LEE KIAN
SG10 patents
Patents
10 patentsUS6507114B2Jan 14, 2003
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die
MICRON TECHNOLOGY INC87 citations97
US6638792B2Oct 28, 2003
Method for fabricating BOC semiconductor package
MICRON TECHNOLOGY INC74 citations92
US7202556B2Apr 10, 2007
Semiconductor package having substrate with multi-layer metal bumps
MICRON TECHNOLOGY INC21 citations91
US7208828B2Apr 24, 2007
Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
MICRON TECHNOLOGY INC17 citations86
US7465488B2Dec 16, 2008
Bow control in an electronic package
MICRON TECHNOLOGY INC5 citations73
US7161236B2Jan 9, 2007
Bow control in an electronic package
MICRON TECHNOLOGY INC4 citations73
US7253022B2Aug 7, 2007
Method for fabricating semiconductor package with multi-layer metal bumps
MICRON TECHNOLOGY INC9 citations72
US6781248B2Aug 24, 2004
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged
MICRON TECHNOLOGY INC10 citations68
US7235872B2Jun 26, 2007
Bow control in an electronic package
MICRON TECHNOLOGY INC1 citations62
US7550315B2Jun 23, 2009
Method for fabricating semiconductor package with multi-layer die contact and external contact
MICRON TECHNOLOGY INC2 citations61