Inventor · disambiguated record

Boon Seng Tan

Also filed as: TAN BOON SENG

2 granted patents·11 citations·filing 2000–2005

57Inventor score

Technology areasH10W

Files withINTEL CORP2

Top patents by PatentIndex Score

2 records

0174US7220624B2Windowed package for electronic circuitryINTEL CORP·Filed 2005·Granted May 22, 2007·8 cites·6 claims
0244US7242088B2IC package pressure release apparatus and methodINTEL CORP·Filed 2000·Granted Jul 10, 2007·3 cites·16 claims

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