P

Inventor

LU TSUO-WEN

TW39 patents
⚠️ This page may combine multiple inventors who share the name “LU TSUO-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

27 patents
US10204788B1Feb 12, 2019

Method of forming high dielectric constant dielectric layer by atomic layer deposition

UNITED MICROELECTRONICS CORP341 citations98
US10797157B1Oct 6, 2020

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP17 citations94
US9685533B1Jun 20, 2017

Transistor with SiCN/SiOCN mulitlayer spacer

UNITED MICROELECTRONICS CORP17 citations92
US9431483B1Aug 30, 2016

Nanowire and method of fabricating the same

UNITED MICROELECTRONICS CORP16 citations92
US9130014B2Sep 8, 2015

Method for fabricating shallow trench isolation structure

UNITED MICROELECTRONICS CORP8 citations84
US11171091B2Nov 9, 2021

Semiconductor device having contact plug connected to gate structure on PMOS region

UNITED MICROELECTRONICS CORP4 citations83
US10217750B1Feb 26, 2019

Buried word line structure and method of making the same

UNITED MICROELECTRONICS CORP9 citations83
US9871136B2Jan 16, 2018

Semiconductor device

UNITED MICROELECTRONICS CORP7 citations82
US11749743B2Sep 5, 2023

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP2 citations73
US9882022B2Jan 30, 2018

Method for manufacturing transistor with SiCN/SiOCN multilayer spacer

UNITED MICROELECTRONICS CORP2 citations73
US12057401B2Aug 6, 2024

Semiconductor device having contact plug connected to gate structure on PMOS region

UNITED MICROELECTRONICS CORP1 citations72
US11756888B2Sep 12, 2023

Semiconductor device having contact plug connected to gate structure on PMOS region

UNITED MICROELECTRONICS CORP2 citations72
US10497704B2Dec 3, 2019

Buried word line structure and method of making the same

UNITED MICROELECTRONICS CORP3 citations72
US9034705B2May 19, 2015

Method of forming semiconductor device

UNITED MICROELECTRONICS CORP5 citations72
US10056288B1Aug 21, 2018

Semiconductor device and fabrication method thereof

UNITED MICROELECTRONICS CORP2 citations71
US12438092B2Oct 7, 2025

Semiconductor device having contact plug connected to gate structure on PMOS region

UNITED MICROELECTRONICS CORP0 citations62
US12107151B2Oct 1, 2024

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations62
US11508832B2Nov 22, 2022

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations62
US10991810B2Apr 27, 2021

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations62
US9330902B1May 3, 2016

Method for forming HfOx film based on atomic layer deposition (ALD) process

UNITED MICROELECTRONICS CORP2 citations62
US9117878B2Aug 25, 2015

Method for manufacturing shallow trench isolation

UNITED MICROELECTRONICS CORP3 citations62
US11133320B2Sep 28, 2021

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP0 citations60
US10658369B2May 19, 2020

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP1 citations60
US9735235B2Aug 15, 2017

Nanowire and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations52
US10847517B2Nov 24, 2020

Method for forming semiconductor device having a multi-thickness gate trench dielectric layer

UNITED MICROELECTRONICS CORP0 citations51
US10373958B2Aug 6, 2019

Semiconductor device having a multi-thickness gate trench dielectric layer

UNITED MICROELECTRONICS CORP0 citations51
US9349599B1May 24, 2016

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP0 citations48

FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD

4 patents

LU TSUO-WEN

3 patents

Wang shao-wei

3 patents

CHIEN CHIN-CHENG

1 patent

WEN TSAI-YU

1 patent