Inventor
LIN YIN-CHEN
TW6 patents
Patents
6 patentsUS11177206B2Nov 16, 2021
Double-sided flexible circuit board and layout structure thereof
CHIPBOND TECHNOLOGY CORP0 citations59
US9247635B2Jan 26, 2016
Flexible substrate
CHIPBOND TECHNOLOGY CORP2 citations56
US12089326B2Sep 10, 2024
Double-sided flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations49
US11206735B2Dec 21, 2021
Flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations49
US12456673B2Oct 28, 2025
Flip chip package and substrate thereof
CHIPBOND TECHNOLOGY CORP0 citations47
US11602047B2Mar 7, 2023
Circuit board tape and joining method thereof
CHIPBOND TECHNOLOGY CORP0 citations46