Inventor

WENG CHENG-YI

TW7 patents

⚠️ This page may combine multiple inventors who share the name “WENG CHENG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

2 patents

US8012797B2Sep 6, 2011

Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries

ADVANCED SEMICONDUCTOR ENG146 citations97

US7838334B2Nov 23, 2010

Package-on-package device, semiconductor package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG71 citations94

WENG CHENG-YI

2 patents

US8198131B2Jun 12, 2012

Stackable semiconductor device packages

WENG CHENG-YI15 citations80

US8569885B2Oct 29, 2013

Stacked semiconductor packages and related methods

WENG CHENG-YI3 citations58

CHEN KUANG-HSIUNG

1 patent

US8076765B2Dec 13, 2011

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

CHEN KUANG-HSIUNG52 citations91

CHU CHI-CHIH

1 patent

US8405212B2Mar 26, 2013

Semiconductor package

CHU CHI-CHIH16 citations79

CHIPMOS TECHNOLOGIES INC

1 patent

US9735132B1Aug 15, 2017

Semiconductor package

CHIPMOS TECHNOLOGIES INC1 citations51