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Inventor
OHKABE TAKUMI
JP
3 patents
⚠️ This page may combine multiple inventors who share the name “OHKABE TAKUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON MICROMETAL CORP
2 patents
US12412864B2
Sep 9, 2025
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP
0 citations
60
US11342299B2
May 24, 2022
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP
0 citations
60
NIPPON STEEL CHEMICAL & MAT CO LTD
1 patent
US11612966B2
Mar 28, 2023
Ag alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD
2 citations
70